GENESTAR™ for blister-resistant reflow components
A wide range of requirements need to be taken into account when designing electronic components. These include the influence of variations in temperature and humidity, exposure to severe vibrations, flammability, ease of processing, electrical properties and water absorption before reflow soldering. Unlike many resins, which are optimized in one dimension and offer the best-in-class performance for a specific property, GENESTAR™ heat-resistant polyamide resins have a well-balanced performance profile. Thanks to their high and consistent performance across a wide range of properties, GENESTAR™ heat-resistant polyamide resins are the solution of choice for many requirements.